{"id":28,"date":"2024-12-03T15:07:26","date_gmt":"2024-12-03T15:07:26","guid":{"rendered":"https:\/\/fke.utm.my\/ece2025\/?page_id=28"},"modified":"2025-12-24T10:53:32","modified_gmt":"2025-12-24T02:53:32","slug":"home","status":"publish","type":"page","link":"https:\/\/fke.utm.my\/ece2025\/","title":{"rendered":"Home"},"content":{"rendered":"

[et_pb_section fb_built=”1″ custom_padding_last_edited=”on|phone” admin_label=”Header” _builder_version=”4.27.4″ use_background_color_gradient=”on” background_color_gradient_stops=”#001b56 28%|#0e4de3 100%” background_color_gradient_start=”#001b56″ background_color_gradient_start_position=”28%” background_color_gradient_end=”#0e4de3″ background_image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/01\/causeway-2.png” parallax=”on” parallax_method=”off” background_blend=”multiply” custom_margin=”||||false|false” custom_margin_last_edited=”off|tablet” custom_padding=”10vw||0vw||false|false” custom_padding_tablet=”||75vw||false|false” custom_padding_phone=”” locked=”off” global_colors_info=”{}”][et_pb_row disabled_on=”off|off|off” _builder_version=”4.27.4″ background_color=”rgba(0,0,0,0.6)” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text disabled_on=”off|off|off” _builder_version=”4.27.4″ text_font=”Exo 2|||on|||||” text_text_color=”#fdba5f” text_letter_spacing=”1px” text_orientation=”center” animation_style=”zoom” global_colors_info=”{}”]<\/p>\n

Welcome<\/p>\n

[\/et_pb_text][et_pb_text _builder_version=”4.27.4″ text_font=”ABeeZee||||||||” text_font_size=”12px” header_font=”Happy Monkey|700|||||||” header_text_align=”center” header_text_color=”#FFFFFF” header_font_size=”86px” header_letter_spacing=”6px” text_orientation=”center” background_layout=”dark” animation_style=”slide” animation_direction=”bottom” header_font_size_tablet=”48px” header_font_size_phone=”28px” header_font_size_last_edited=”on|desktop” global_colors_info=”{}”]<\/p>\n

ECE2025<\/h1>\n

[\/et_pb_text][et_pb_text _builder_version=”4.27.4″ text_font=”Albert Sans|600|||||||” text_font_size=”20px” text_line_height=”1.5em” text_orientation=”center” background_layout=”dark” max_width=”700px” module_alignment=”center” animation_style=”slide” animation_direction=”bottom” text_font_size_tablet=”15px” text_font_size_phone=”14px” text_font_size_last_edited=”on|phone” custom_css_free_form=”.et_pb_text sup, \/* Text Module *\/||.et_pb_blurb sup, \/* Blurb Module *\/||.et_pb_slider sup, \/* Slider Module *\/||.et_pb_testimonial sup, \/* Testimonial Module *\/||.et_pb_accordion_item sup, \/* Accordion Module *\/||.et_pb_toggle sup, \/* Toggle Module *\/||.et_pb_cta sup \/* Call to Action Module *\/ ||{|| font-size: 75%; \/* adjust as needed *\/|| bottom: 0.5em; \/* increase to raise the superscript – the default value is 0.8em *\/||}” global_colors_info=”{}”]<\/p>\n

2nd<\/sup> International Conference on Electronic and Computer Engineering<\/p>\n

Holiday Inn Johor Bahru City Centre, Johor, Malaysia<\/p>\n

21-22 August 2025<\/p>\n

 <\/p>\n

[\/et_pb_text][et_pb_button button_url=”https:\/\/fke.utm.my\/ece2025\/callpaper\/” button_text=”Call for PAPER” button_alignment=”center” disabled_on=”on|on|on” _builder_version=”4.27.4″ custom_button=”on” button_text_size=”14px” button_text_color=”#001955″ button_bg_color=”#fdba5f” button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_margin=”-1px|||||” custom_padding=”10px|30px|10px|30px|true|true” animation_style=”slide” animation_direction=”bottom” disabled=”on” global_colors_info=”{}”][\/et_pb_button][et_pb_button button_url=”https:\/\/ieeexplore.ieee.org\/xpl\/conhome\/11276138\/proceeding” url_new_window=”on” button_text=”PROCEEDING PUBLISHED ON IEEE EXPLORE” button_alignment=”center” disabled_on=”off|off|off” _builder_version=”4.27.5″ custom_button=”on” button_text_size=”14px” button_text_color=”#001955″ button_bg_color=”#fdba5f” button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_margin=”-1px|||||” custom_padding=”10px|30px|10px|30px|true|true” animation_style=”slide” animation_direction=”bottom” global_colors_info=”{}”][\/et_pb_button][et_pb_button button_url=”https:\/\/drive.google.com\/drive\/folders\/1CpJh9tQg2U3w4dp-UMcLXOFl64vafSXq?usp=drive_link” url_new_window=”on” button_text=”Donwload Program Book” button_alignment=”center” _builder_version=”4.27.4″ custom_button=”on” button_text_size=”14px” button_text_color=”#001955″ button_bg_color=”#fdba5f” button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_margin=”-1px|||||” custom_padding=”10px|30px|10px|30px|true|true” animation_style=”slide” animation_direction=”bottom” global_colors_info=”{}”][\/et_pb_button][et_pb_button button_url=”https:\/\/fke.utm.my\/ece2025\/event-day\/” button_text=”Tentative Program” button_alignment=”center” disabled_on=”off|off|off” _builder_version=”4.27.4″ custom_button=”on” button_text_size=”14px” button_text_color=”#001955″ button_bg_color=”#fdba5f” button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_margin=”-1px|||||” custom_padding=”10px|30px|10px|30px|true|true” animation_style=”slide” animation_direction=”bottom” global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ admin_label=”Services” _builder_version=”4.16″ global_colors_info=”{}”][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.5″ text_line_height=”1.6em” header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”35px” locked=”off” global_colors_info=”{}”]<\/p>\n

Proceeding Published<\/h2>\n

[\/et_pb_text][et_pb_blurb title=”IEEE Explore” image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/12\/published.jpg” image_icon_width=”59%” _builder_version=”4.27.5″ _module_preset=”default” header_text_align=”center” text_orientation=”center” hover_enabled=”0″ custom_css_blurb_image=”transition-duration: 1s;” global_colors_info=”{}” custom_css_blurb_image__hover_enabled=”on|hover” custom_css_blurb_image__hover=”transform:rotatey(360deg);” link_option_url=”https:\/\/ieeexplore.ieee.org\/xpl\/conhome\/11276138\/proceeding” link_option_url_new_window=”on” url=”https:\/\/ieeexplore.ieee.org\/xpl\/conhome\/11276138\/proceeding” url_new_window=”on” sticky_enabled=”0″]<\/p>\n

Check it out now!<\/p>\n

[\/et_pb_blurb][et_pb_text _builder_version=”4.27.4″ text_line_height=”1.6em” header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”35px” locked=”off” global_colors_info=”{}”]<\/p>\n

Conference Tracks<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_4,1_4,1_4,1_4″ use_custom_gutter=”on” gutter_width=”2″ _builder_version=”4.27.4″ use_background_color_gradient=”on” background_color_gradient_stops=”rgba(255,255,255,0) 0%|#eaf3ff 100%” background_color_gradient_start=”rgba(255,255,255,0)” background_color_gradient_end=”#eaf3ff” max_width=”1160px” overflow-x=”visible” overflow-y=”visible” custom_padding=”60px|40px|60px|40px|true|true” animation_style=”slide” animation_direction=”right” border_radii=”off|||60px|60px” locked=”off” global_colors_info=”{}”][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_blurb title=”Machine Learning and Pattern Recognition” image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2024\/12\/robotics-icon-dark-13.jpg” content_max_width=”100%” _builder_version=”4.27.4″ header_font=”Exo 2|600|||||||” header_text_color=”#323770″ header_font_size=”18px” header_line_height=”1.8em” body_font=”PT Sans||||||||” text_orientation=”center” animation=”off” border_radii_image=”on|12px|12px|12px|12px” box_shadow_style_image=”preset1″ box_shadow_vertical_image=”12px” box_shadow_color_image=”rgba(98,116,138,0.16)” global_colors_info=”{}”][\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_blurb title=”Nanotechnology and Advanced Materials” image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2024\/12\/robotics-icon-dark-2.jpg” content_max_width=”100%” _builder_version=”4.27.4″ header_font=”Exo 2|600|||||||” header_text_color=”#323770″ header_font_size=”18px” header_line_height=”1.8em” body_font=”PT Sans||||||||” text_orientation=”center” animation=”off” border_radii_image=”on|12px|12px|12px|12px” box_shadow_style_image=”preset1″ box_shadow_vertical_image=”12px” box_shadow_color_image=”rgba(98,116,138,0.16)” global_colors_info=”{}”][\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_blurb title=”Biosensors, Biosignals, and Biomedical Imaging” image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2024\/12\/robotics-icon-dark-3.jpg” content_max_width=”100%” _builder_version=”4.27.4″ header_font=”Exo 2|600|||||||” header_text_color=”#323770″ header_font_size=”18px” header_line_height=”1.8em” body_font=”PT Sans||||||||” text_orientation=”center” animation=”off” border_radii_image=”on|12px|12px|12px|12px” box_shadow_style_image=”preset1″ box_shadow_vertical_image=”12px” box_shadow_color_image=”rgba(98,116,138,0.16)” locked=”off” global_colors_info=”{}”][\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_blurb title=”VLSI and Computing Architecture” image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2024\/12\/robotics-icon-dark-4.jpg” content_max_width=”100%” _builder_version=”4.27.4″ header_font=”Exo 2|600|||||||” header_text_color=”#323770″ header_font_size=”18px” header_line_height=”1.8em” body_font=”PT Sans||||||||” text_orientation=”center” animation=”off” border_radii_image=”on|12px|12px|12px|12px” box_shadow_style_image=”preset1″ box_shadow_vertical_image=”12px” box_shadow_color_image=”rgba(98,116,138,0.16)” locked=”off” global_colors_info=”{}”][\/et_pb_blurb][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ admin_label=”Feature” _builder_version=”4.27.4″ overflow-x=”hidden” overflow-y=”hidden” animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_row column_structure=”1_2,1_2″ _builder_version=”4.16″ locked=”off” global_colors_info=”{}”][et_pb_column type=”1_2″ _builder_version=”4.16″ z_index=”10″ custom_padding=”80px||||false|false” custom_padding_tablet=”0px||||false|false” custom_padding_phone=”” custom_padding_last_edited=”on|tablet” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2|600|||||||” header_2_text_align=”left” header_2_font_size=”48px” header_2_line_height=”1.3em” module_alignment=”center” header_2_text_align_tablet=”center” header_2_text_align_last_edited=”off|tablet” header_2_font_size_tablet=”32px” header_2_font_size_phone=”20px” header_2_font_size_last_edited=”on|phone” global_colors_info=”{}”]<\/p>\n

About ECE2025<\/h2>\n

[\/et_pb_text][et_pb_text _builder_version=”4.27.4″ text_font=”PT Sans||||||||” text_font_size=”17px” text_line_height=”1.9em” module_alignment=”center” text_font_size_tablet=”15px” text_font_size_phone=”14px” text_font_size_last_edited=”on|tablet” text_orientation_tablet=”center” text_orientation_last_edited=”off|tablet” global_colors_info=”{}”]<\/p>\n

The 2nd<\/sup> International Conference on Electronic and Computer Engineering (ECE2025) will be held on 21-22 Aug 2025 at Johor Bahru. The conference is organized by the Department of Electronic and Computer Engineering, Faculty of Electrical Engineering, Universiti Teknologi Malaysia and co-sponsored by the IEEE Electron Devices Society (EDS) Malaysia Chapter.<\/p>\n

ECE2025 aims at bringing together researchers from industry and academia from all over the world to gather and explore various issues and trends in the field of Electronics and Computer Engineering. This conference provides opportunities for the researchers to share their research and experiences, establish research relations, and globally collaborate among them.<\/p>\n

The ECE2025 is a prominent international forum on four main tracks which are Machine Learning and Pattern Recognition, Nanotechnology and Advanced Materials, Biosensors, Biosignals and Biomedical Imaging and VLSI & Computer Architecture.<\/p>\n

[\/et_pb_text][et_pb_button button_text=”About Us” button_alignment=”left” disabled_on=”on|on|on” _builder_version=”4.16″ custom_button=”on” button_text_size=”14px” button_text_color=”#ffffff” button_bg_color=”#0e4de3″ button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_padding=”10px|30px|10px|30px|true|true” box_shadow_style=”preset3″ box_shadow_color=”rgba(14,77,227,0.2)” disabled=”on” locked=”off” global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][et_pb_column type=”1_2″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2024\/12\/robotics-20.png” title_text=”Mahkota Johor” align=”right” _builder_version=”4.27.4″ background_image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2024\/12\/Mahkota-Johor.jpg” background_position=”center_left” background_horizontal_offset=”16%” custom_margin=”|-20vw|||false|false” locked=”off” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”48px” locked=”off” global_colors_info=”{}”]<\/p>\n

Why ECE2025?<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_4,1_4,1_4,1_4″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”1_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”Hybrid Conference” image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/webinar-1.png” image_icon_width=”59%” _builder_version=”4.27.4″ _module_preset=”default” header_text_align=”center” text_orientation=”center” custom_css_blurb_image=”transition-duration: 1s;” global_colors_info=”{}” custom_css_blurb_image__hover_enabled=”on|hover” custom_css_blurb_image__hover=”transform:rotatey(360deg);”]<\/p>\n

Virtual presentation available for Overseas participants<\/p>\n

[\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”Scopus Indexed” image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/scopus.png” image_icon_width=”59%” _builder_version=”4.27.4″ _module_preset=”default” header_text_align=”center” text_orientation=”center” custom_css_blurb_image=”transition-duration: 1s;” global_colors_info=”{}” custom_css_blurb_image__hover_enabled=”on|hover” custom_css_blurb_image__hover=”transform:rotatey(360deg);”]<\/p>\n

Presented papers will be submited for publication in IEEE Xplore Digital Library<\/strong><\/p>\n

[\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”48px” locked=”off” global_colors_info=”{}”]<\/p>\n

Organizers<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_2,1_2″ _builder_version=”4.27.4″ _module_preset=”default” max_width=”852px” global_colors_info=”{}”][et_pb_column type=”1_2″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/02\/LOGO-UTM.png” title_text=”LOGO-UTM” align=”center” _builder_version=”4.27.4″ _module_preset=”default” width=”74%” width_tablet=”60%” width_phone=”65%” width_last_edited=”on|phone” module_alignment=”right” custom_padding=”9px||||false|false” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_2″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/02\/Screen-Shot-2020-12-02-at-6.46.57-PM.png” title_text=”Screen-Shot-2020-12-02-at-6.46.57-PM” align=”center” src_last_edited=”off|phone” align_tablet=”center” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”74%” width_tablet=”74%” width_phone=”70%” width_last_edited=”on|phone” module_alignment=”left” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ admin_label=”Partners” _builder_version=”4.16″ global_colors_info=”{}”][et_pb_row disabled_on=”off|off|off” _builder_version=”4.27.4″ animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”40px” locked=”off” global_colors_info=”{}”]<\/p>\n

Gold Sponsors<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_4,1_4,1_4,1_4″ disabled_on=”on|on|on” _builder_version=”4.27.4″ width=”46%” width_tablet=”” width_phone=”50%” width_last_edited=”on|phone” animation_style=”slide” animation_direction=”left” disabled=”on” global_colors_info=”{}”][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/07\/skyechip.png” title_text=”skyechip” url=”https:\/\/maistorage.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/04\/Gold-amd_logo.jpg” title_text=”Gold amd_logo” url=”https:\/\/www.amd.com\/en\/corporate.html” url_new_window=”on” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/06\/MaiSTORAGE-v2.png” title_text=”MaiSTORAGE v2″ url=”https:\/\/maistorage.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/07\/tenasic-logo.png” url=”https:\/\/maistorage.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” locked=”off” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_4,1_4,1_4,1_4″ disabled_on=”off|off|off” _builder_version=”4.27.4″ width=”55%” width_tablet=”” width_phone=”50%” width_last_edited=”on|phone” animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/07\/skyechip.png” title_text=”skyechip” url=”https:\/\/skyechip.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” max_width=”75%” module_alignment=”center” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/04\/Gold-amd_logo.jpg” title_text=”Gold amd_logo” url=”https:\/\/www.amd.com\/en\/corporate.html” url_new_window=”on” _builder_version=”4.27.4″ _module_preset=”default” max_width=”70%” module_alignment=”center” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/06\/MaiSTORAGE-v2.png” title_text=”MaiSTORAGE v2″ url=”https:\/\/maistorage.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/08\/Tenasicv5.png” title_text=”Tenasicv5″ url=”https:\/\/www.tenasictech.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” width=”96%” module_alignment=”center” custom_margin=”0px||||false|false” locked=”off” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row disabled_on=”on|on|on” _builder_version=”4.27.4″ _module_preset=”default” disabled=”on” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”48px” locked=”off” global_colors_info=”{}”]<\/p>\n

Keynote Speakers<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_divider _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_divider][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”48px” locked=”off” global_colors_info=”{}”]<\/p>\n

Keynote Speakers<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_5,3_5″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”2_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/Prof-Faizalv2-1.png” title_text=”Prof Faizalv2″ align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”right” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”3_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Prof. Ir. Dr. Mohammad Faizal Bin Ahmad Fauzi ” position=”Professor, Faculty of Artificial Intelligence and Engineering, Multimedia University” _builder_version=”4.27.4″ _module_preset=”default” header_font_size=”22px” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”Towards Precision Medicine: Machine Learning and Image Processing in Digital Pathology” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”]<\/p>\n

Digital pathology is the management and interpretation of pathology information in a digital environment that enables better, faster and cheaper diagnosis and prognosis of cancer and other diseases. With the advent of whole-slide imaging, the field of digital and computational pathology has gained a lot of traction, especially among the machine learning and image processing communities. Precision medicine, or personalized medicine, on the other hand aims to tailor treatments to individuals based on their unique characteristics, moving away from the one-size-fits-all approach of traditional medicine. In this lecture, I will discuss our work in developing computer-aided systems for breast cancer precision medicine from whole-slide pathology images.<\/span><\/p>\n

[\/et_pb_toggle][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_3,1_3″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”right” global_colors_info=”{}”][et_pb_column type=”2_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Prof. Dr. T. Nandha Kumar” position=”Professor, Department of Electrical and Electronic Engineering, University of Nottingham Malaysia” _builder_version=”4.27.4″ _module_preset=”default” header_text_align=”right” header_font_size=”22px” body_text_align=”right” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”In-Memory Computing Across Memory Technologies \u2014 SRAM, DRAM, and Memristors: Design Insights and Challenges” _builder_version=”4.27.4″ _module_preset=”default” title_text_align=”right” global_colors_info=”{}”]<\/p>\n

Traditional computational systems have long relied on the Von Neumann architecture, which separates memory and processing units. This architecture requires frequent data transfers between memory and the central processing unit (CPU), leading to a performance bottleneck known as the \u201cmemory wall.”\u00a0<\/p>\n

The growing demands of artificial intelligence (AI), big data, and cloud-scale applications have shifted computational workloads from being compute-intensive to memory-intensive, intensifying the strain on data movement and memory bandwidth.<\/p>\n

In this context, In-Memory Computing (IMC) has emerged as a promising paradigm that enables computations\u2014particularly data-heavy operations such as matrix multiplications\u2014to be performed directly within memory arrays. This approach reduces data movement, enhances performance, and improves energy efficiency.<\/p>\n

This talk will present an overview of IMC techniques implemented using SRAM, DRAM, and the emerging Resistive RAM (ReRAM or Memristors). It will explore their underlying design principles, compare their architectural and circuit-level trade-offs, and discuss the challenges of scalability, reliability, and integration with conventional computing systems.<\/p>\n

[\/et_pb_toggle][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/Nanda.jpg” title_text=”Nanda” align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”left” custom_margin=”|128px||||” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_5,3_5″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”2_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/Liew.png” title_text=”Liew” align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”right” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”3_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Mr. Michael Liew Woon Chin” position=”CTO & Chief Architect, Tenasic Technology Sdn. Bhd.” _builder_version=”4.27.4″ _module_preset=”default” header_font_size=”22px” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”AI-Powered SOC Design: Unlocking Innovation, Efficiency and Complexity Management” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”]<\/p>\n

The semiconductor industry is undergoing a profound transformation driven by increasing design complexity, accelerated product life cycles, and the growing need for innovation at scale. At the heart of this evolution lies the potential of Artificial Intelligence (AI) to revolutionize System-on-Chip (SoC) design. This speech explores how AI-driven methodologies empower design houses to stay competitive and agile in the face of mounting challenges.<\/p>\n

As SoCs become more heterogeneous and densely packed with IP blocks\u2014CPU clusters, AI accelerators, security engines, and high-speed interfaces\u2014the complexity of design, verification, and optimization has grown exponentially. Traditional design methods are increasingly insufficient to manage this scale and pace. AI introduces intelligent automation across the SoC lifecycle\u2014from RTL generation and floorplanning to timing closure and functional verification\u2014resulting in faster iterations, improved performance-per-watt, and reduced time-to-market.<\/p>\n

We have embraced this transformation firsthand through the development of our innovative SoCs from IOT, Edge, Client to Data Center SOC, each built using AI-assisted design techniques. Leveraging these approaches has significantly improved design quality, enhanced engineering efficiency, and enabled us to meet aggressive delivery schedules. By integrating AI into key phases of our development process, we\u2019ve achieved higher confidence in first-pass silicon while empowering our design teams to focus on architectural innovation and product differentiation.<\/p>\n

Ultimately, this presentation positions AI-augmented SoC design not just as a technological enhancement, but as a strategic necessity for design houses navigating the pressures of innovation, shrinking development windows, and increasingly complex chip architectures. Attendees will gain insight into real-world examples, current AI-enabled EDA tools, and how embracing these techniques can redefine the future of semiconductor design.<\/p>\n

[\/et_pb_toggle][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_3,1_3″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”right” global_colors_info=”{}”][et_pb_column type=”2_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Mr. J-Wing Teh” position=”Director of Silicon Design Engineering , AMD Malaysia” _builder_version=”4.27.4″ _module_preset=”default” header_text_align=”right” header_font_size=”22px” body_text_align=”right” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”Designing for High Performance Computing : Evolving Challenges in Semiconductor Design” _builder_version=”4.27.4″ _module_preset=”default” title_text_align=”right” global_colors_info=”{}”]<\/p>\n

In this talk, we delve into the foundational components of modern computing systems: interconnects, compute engines, and memory, highlighting their rapid evolution in driving advanced applications and superior performance. Key trends include the surge in interconnect bandwidth, with PCI Express now achieving rates up to 256GB\/s, and the persistent doubling of transistor density every 1.5 to 3 years. Addressing the gaps in transistor scalability, interconnect bandwidth, and memory performance is crucial for unlocking future semiconductor innovations and maintaining the momentum of technological progress.<\/p>\n

[\/et_pb_toggle][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/06\/jw-tech.png” title_text=”jw tech” align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”left” custom_margin=”|128px||||” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ disabled_on=”on|on|on” admin_label=”Partners” _builder_version=”4.16″ disabled=”on” global_colors_info=”{}”][et_pb_row disabled_on=”off|off|off” _builder_version=”4.27.4″ animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”40px” locked=”off” global_colors_info=”{}”]<\/p>\n

Gold Sponsors<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_3,1_3,1_3″ disabled_on=”off|off|off” _builder_version=”4.27.4″ width=”46%” width_tablet=”” width_phone=”50%” width_last_edited=”on|phone” animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”1_3″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/07\/skyechip.png” title_text=”skyechip” url=”https:\/\/maistorage.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/04\/Gold-amd_logo.jpg” title_text=”Gold amd_logo” url=”https:\/\/www.amd.com\/en\/corporate.html” url_new_window=”on” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/06\/MaiSTORAGE-v2.png” title_text=”MaiSTORAGE v2″ url=”https:\/\/maistorage.com\/” url_new_window=”on” align=”center” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row disabled_on=”off|off|off” _builder_version=”4.16″ global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”35px” animation_style=”slide” animation_direction=”right” locked=”off” global_colors_info=”{}”]<\/p>\n

Silver Sponsors<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_3,1_3,1_3″ disabled_on=”off|off|off” _builder_version=”4.27.4″ width_tablet=”” width_phone=”35%” width_last_edited=”on|phone” animation_style=”slide” animation_direction=”right” global_colors_info=”{}”][et_pb_column type=”1_3″ _builder_version=”4.16″ global_colors_info=”{}”][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/07\/tenasic-logo.png” title_text=”tenasic logo” url=”https:\/\/www.tenasictech.com\/” url_new_window=”on” _builder_version=”4.27.4″ _module_preset=”default” width=”65%” module_alignment=”center” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.16″ global_colors_info=”{}”][\/et_pb_column][\/et_pb_row][et_pb_row disabled_on=”on|on|on” _builder_version=”4.27.4″ _module_preset=”default” disabled=”on” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”48px” locked=”off” global_colors_info=”{}”]<\/p>\n

Keynote Speakers<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_divider _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_divider][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2||||||||” header_2_text_align=”center” header_2_text_color=”#001856″ header_2_font_size=”48px” locked=”off” global_colors_info=”{}”]<\/p>\n

Keynote Speakers<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_5,3_5″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”2_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/Prof-Faizalv2-1.png” title_text=”Prof Faizalv2″ align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”right” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”3_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Prof. Dr. Ir. Mohammad Faizal Bin Ahmad Fauzi ” position=”Professor, Faculty of Artificial Intelligence and Engineering, Multimedia University” _builder_version=”4.27.4″ _module_preset=”default” header_font_size=”22px” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”Towards Precision Medicine: Machine learning and Image Processing in Digital Pathology” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”]<\/p>\n

Digital pathology is the management and interpretation of pathology information in a digital environment that enables better, faster and cheaper diagnosis and prognosis of cancer and other diseases. With the advent of whole-slide imaging, the field of digital and computational pathology has gained a lot of traction, especially among the machine learning and image processing communities. Precision medicine, or personalized medicine, on the other hand aims to tailor treatments to individuals based on their unique characteristics, moving away from the one-size-fits-all approach of traditional medicine. In this lecture, I will discuss our work in developing computer-aided systems for breast cancer precision medicine from whole-slide pathology images.<\/span><\/p>\n

[\/et_pb_toggle][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_3,1_3″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”right” global_colors_info=”{}”][et_pb_column type=”2_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Prof. Dr. T. Nandha Kumar” position=”Professor, Department of Electrical and Electronic Engineering, University of Nottingham Malaysia” _builder_version=”4.27.4″ _module_preset=”default” header_text_align=”right” header_font_size=”22px” body_text_align=”right” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”In-Memory Computing Across Memory Technologies \u2014 SRAM, DRAM, and Memristors: Design Insights and Challenges” _builder_version=”4.27.4″ _module_preset=”default” title_text_align=”right” global_colors_info=”{}”]<\/p>\n

Traditional computational systems have long relied on the Von Neumann architecture, which separates memory and processing units. This architecture requires frequent data transfers between memory and the central processing unit (CPU), leading to a performance bottleneck known as the \u201cmemory wall.”\u00a0<\/p>\n

The growing demands of artificial intelligence (AI), big data, and cloud-scale applications have shifted computational workloads from being compute-intensive to memory-intensive, intensifying the strain on data movement and memory bandwidth.<\/p>\n

In this context, In-Memory Computing (IMC) has emerged as a promising paradigm that enables computations\u2014particularly data-heavy operations such as matrix multiplications\u2014to be performed directly within memory arrays. This approach reduces data movement, enhances performance, and improves energy efficiency.<\/p>\n

This talk will present an overview of IMC techniques implemented using SRAM, DRAM, and the emerging Resistive RAM (ReRAM or Memristors). It will explore their underlying design principles, compare their architectural and circuit-level trade-offs, and discuss the challenges of scalability, reliability, and integration with conventional computing systems.<\/p>\n

[\/et_pb_toggle][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/Nanda.jpg” title_text=”Nanda” align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”left” custom_margin=”|128px||||” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_5,3_5″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”left” global_colors_info=”{}”][et_pb_column type=”2_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/05\/Liew.png” title_text=”Liew” align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”right” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][et_pb_column type=”3_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Mr. Michael Liew Woon Chin” position=”CTO & Chief Architect, Tenasic Technology Sdn. Bhd.” _builder_version=”4.27.4″ _module_preset=”default” header_font_size=”22px” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”AI-Powered SOC Design: Unlocking Innovation, Efficiency and Complexity Management” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”]<\/p>\n

The semiconductor industry is undergoing a profound transformation driven by increasing design complexity, accelerated product life cycles, and the growing need for innovation at scale. At the heart of this evolution lies the potential of Artificial Intelligence (AI) to revolutionize System-on-Chip (SoC) design. This speech explores how AI-driven methodologies empower design houses to stay competitive and agile in the face of mounting challenges.<\/p>\n

As SoCs become more heterogeneous and densely packed with IP blocks\u2014CPU clusters, AI accelerators, security engines, and high-speed interfaces\u2014the complexity of design, verification, and optimization has grown exponentially. Traditional design methods are increasingly insufficient to manage this scale and pace. AI introduces intelligent automation across the SoC lifecycle\u2014from RTL generation and floorplanning to timing closure and functional verification\u2014resulting in faster iterations, improved performance-per-watt, and reduced time-to-market.<\/p>\n

We have embraced this transformation firsthand through the development of our innovative SoCs from IOT, Edge, Client to Data Center SOC, each built using AI-assisted design techniques. Leveraging these approaches has significantly improved design quality, enhanced engineering efficiency, and enabled us to meet aggressive delivery schedules. By integrating AI into key phases of our development process, we\u2019ve achieved higher confidence in first-pass silicon while empowering our design teams to focus on architectural innovation and product differentiation.<\/p>\n

Ultimately, this presentation positions AI-augmented SoC design not just as a technological enhancement, but as a strategic necessity for design houses navigating the pressures of innovation, shrinking development windows, and increasingly complex chip architectures. Attendees will gain insight into real-world examples, current AI-enabled EDA tools, and how embracing these techniques can redefine the future of semiconductor design.<\/p>\n

[\/et_pb_toggle][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”2_3,1_3″ disabled_on=”off|off|off” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”right” global_colors_info=”{}”][et_pb_column type=”2_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_team_member name=”Mr. J Wing Teh” position=”Director of Silicon Design Engineering , AMD Malaysia” _builder_version=”4.27.4″ _module_preset=”default” header_text_align=”right” header_font_size=”22px” body_text_align=”right” body_font_size=”18px” global_colors_info=”{}”][\/et_pb_team_member][et_pb_toggle title=”Designing for High Performance Computing : Evolving Challenges in Semiconductor Design” _builder_version=”4.27.4″ _module_preset=”default” title_text_align=”right” global_colors_info=”{}”]<\/p>\n

In this talk, we delve into the foundational components of modern computing systems: interconnects, compute engines, and memory, highlighting their rapid evolution in driving advanced applications and superior performance. Key trends include the surge in interconnect bandwidth, with PCI Express now achieving rates up to 256GB\/s, and the persistent doubling of transistor density every 1.5 to 3 years. Addressing the gaps in transistor scalability, interconnect bandwidth, and memory performance is crucial for unlocking future semiconductor innovations and maintaining the momentum of technological progress.<\/p>\n

[\/et_pb_toggle][\/et_pb_column][et_pb_column type=”1_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_image src=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2025\/06\/jw-tech.png” title_text=”jw tech” align_tablet=”” align_phone=”” align_last_edited=”on|phone” _builder_version=”4.27.4″ _module_preset=”default” width=”60%” max_width=”60%” module_alignment=”left” custom_margin=”|128px||||” border_radii=”on|1000px|1000px|1000px|1000px” global_colors_info=”{}”][\/et_pb_image][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ custom_padding_last_edited=”on|phone” admin_label=”Services” _builder_version=”4.27.4″ use_background_color_gradient=”on” background_color_gradient_stops=”#001b56 0%|#01217d 100%” background_color_gradient_start=”#001b56″ background_color_gradient_end=”#01217d” background_image=”https:\/\/fke.utm.my\/ece2025\/wp-content\/uploads\/sites\/24\/2024\/12\/robotics-12.png” background_size=”contain” background_position=”top_left” width=”95.1%” width_tablet=”100%” width_phone=”100%” width_last_edited=”on|phone” module_alignment=”right” custom_margin=”|||153px|false|false” custom_padding=”|1vw|||false|false” custom_padding_tablet=”|0vw|||false|false” custom_padding_phone=”|0vw|||false|false” animation_style=”slide” animation_direction=”right” background_last_edited=”on|tablet” background_enable_image_tablet=”off” background_enable_image_phone=”off” background_size_tablet=”contain” locked=”off” global_colors_info=”{}”][et_pb_row _builder_version=”4.16″ global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ header_2_font=”Exo 2|600|||||||” header_2_text_align=”center” header_2_font_size=”48px” header_2_line_height=”1.3em” background_layout=”dark” header_2_font_size_tablet=”32px” header_2_font_size_phone=”20px” header_2_font_size_last_edited=”on|phone” locked=”off” global_colors_info=”{}” header_2_2_font_size_tablet=”32px” header_3_2_font_size_tablet=”32px” header_4_2_font_size_tablet=”32px” header_5_2_font_size_tablet=”32px” header_6_2_font_size_tablet=”32px” header_2_2_font_size_phone=”20px” header_3_2_font_size_phone=”20px” header_4_2_font_size_phone=”20px” header_5_2_font_size_phone=”20px” header_6_2_font_size_phone=”20px” header_2_2_font_size_last_edited=”on|phone” header_3_2_font_size_last_edited=”on|phone” header_4_2_font_size_last_edited=”on|phone” header_5_2_font_size_last_edited=”on|phone” header_6_2_font_size_last_edited=”on|phone”]<\/p>\n

Important Dates<\/h2>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_6,1_6,1_6,1_6,1_6,1_6″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”1_6″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_column][et_pb_column type=”1_6″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”15 Jan 2025″ use_icon=”on” _builder_version=”4.27.4″ _module_preset=”default” header_font=”|700|||||||” header_text_color=”#FFFFFF” body_text_color=”#FFFFFF” background_color=”RGBA(255,255,255,0)” text_orientation=”center” global_colors_info=”{}”]<\/p>\n

Call for paper<\/p>\n

[\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_6″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”15 June 2025″ use_icon=”on” _builder_version=”4.27.4″ _module_preset=”default” header_font=”|700|||||||” header_text_color=”#FFFFFF” body_text_color=”#FFFFFF” background_color=”RGBA(255,255,255,0)” text_orientation=”center” global_colors_info=”{}”]<\/p>\n

(Extended)
15 Apr 2025<\/span>
Deadline submission of full paper<\/p>\n

[\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_6″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”15 June 2025″ use_icon=”on” _builder_version=”4.27.4″ _module_preset=”default” header_font=”|700|||||||” header_text_color=”#FFFFFF” body_text_color=”#FFFFFF” background_color=”RGBA(255,255,255,0)” text_orientation=”center” global_colors_info=”{}”]<\/p>\n

Notification of acceptance<\/p>\n

[\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_6″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”15 July 2025″ use_icon=”on” _builder_version=”4.27.4″ _module_preset=”default” header_font=”|700|||||||” header_text_color=”#FFFFFF” body_text_color=”#FFFFFF” background_color=”RGBA(255,255,255,0)” text_orientation=”center” global_colors_info=”{}”]<\/p>\n

Early bird registration deadline<\/p>\n

[\/et_pb_blurb][et_pb_button button_url=”https:\/\/fke.utm.my\/ece2025\/registration-2\/” button_text=”Register” button_alignment=”center” _builder_version=”4.27.4″ _module_preset=”default” custom_button=”on” button_text_size=”13px” button_text_color=”#FFFFFF” button_bg_color=”#E09900″ button_border_color=”RGBA(255,255,255,0)” button_border_radius=”22px” button_font=”Exo 2||||||||” button_icon=”A||divi||400″ button_icon_color=”#FFFFFF” global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][et_pb_column type=”1_6″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_5,1_5,1_5,1_5,1_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”1_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_column][et_pb_column type=”1_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”30 July 2025″ use_icon=”on” _builder_version=”4.27.4″ _module_preset=”default” header_font=”|700|||||||” header_text_color=”#FFFFFF” body_text_color=”#FFFFFF” background_color=”RGBA(255,255,255,0)” text_orientation=”center” global_colors_info=”{}”]<\/p>\n

Registration<\/p>\n

[\/et_pb_blurb][et_pb_button button_url=”https:\/\/fke.utm.my\/ece2025\/registration-2\/” button_text=”Register” button_alignment=”center” _builder_version=”4.27.4″ _module_preset=”default” custom_button=”on” button_text_size=”13px” button_text_color=”#FFFFFF” button_bg_color=”#E09900″ button_border_color=”RGBA(255,255,255,0)” button_border_radius=”22px” button_font=”Exo 2||||||||” button_icon=”A||divi||400″ button_icon_color=”#FFFFFF” global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][et_pb_column type=”1_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”18 July 2025″ use_icon=”on” _builder_version=”4.27.4″ _module_preset=”default” header_font=”|700|||||||” header_text_color=”#FFFFFF” body_text_color=”#FFFFFF” background_color=”RGBA(255,255,255,0)” text_orientation=”center” global_colors_info=”{}”]<\/p>\n

Submission of camera-ready paper<\/p>\n

[\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_blurb title=”21-22 Aug 2025″ use_icon=”on” _builder_version=”4.27.4″ _module_preset=”default” header_font=”|700|||||||” header_text_color=”#FFFFFF” body_text_color=”#FFFFFF” background_color=”RGBA(255,255,255,0)” text_orientation=”center” global_colors_info=”{}”]<\/p>\n

Conference day<\/p>\n

[\/et_pb_blurb][\/et_pb_column][et_pb_column type=”1_5″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_countdown_timer title=”Conference Day” date_time=”2025-08-21 02:34″ _builder_version=”4.27.4″ _module_preset=”default” background_color=”#6a81a8″ animation_style=”fade” global_colors_info=”{}”][\/et_pb_countdown_timer][et_pb_divider color=”#FFFFFF” _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][\/et_pb_divider][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” text_font_size=”16px” global_colors_info=”{}”]<\/p>\n

*Accepted and presented papers will be submitted for publication in the IEEE Xplore Digital Library<\/strong><\/span> and for indexing in Scopus<\/strong><\/span>, subject to IEEE’s quality review requirements.<\/p>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||-20px||false|false” animation_style=”fade” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_heading title=”Early Bird Registration” _builder_version=”4.27.4″ _module_preset=”default” title_font=”Exo 2|600|||||||” title_text_align=”center” title_text_color=”#0C71C3″ title_font_size=”26px” background_color=”#FFFFFF” width=”94%” module_alignment=”center” border_radii=”on|8px|8px|8px|8px” global_colors_info=”{}”][\/et_pb_heading][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_4,1_4,1_4,1_4″ use_custom_gutter=”on” gutter_width=”2″ disabled_on=”off|off|off” _builder_version=”4.27.4″ width=”57%” width_tablet=”” width_phone=”60%” width_last_edited=”on|phone” custom_margin=”||||false|false” custom_padding=”||||false|false” animation_style=”slide” global_colors_info=”{}”][et_pb_column type=”1_4″ _builder_version=”4.27.4″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Student<\/h2>\n

(IEEE Member)<\/h2>\n

RM900<\/h1>\n

(USD210)<\/h3>\n

[\/et_pb_text][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Regular<\/h2>\n

(IEEE Member)<\/h2>\n

RM1000<\/h1>\n

(USD250)<\/h3>\n

[\/et_pb_text][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Non-Member<\/h2>\n

 <\/p>\n

RM1200<\/h1>\n

(USD300)<\/h3>\n

[\/et_pb_text][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Non-Presenter<\/h2>\n

 <\/p>\n

RM600<\/h1>\n

(USD150)<\/h3>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” custom_margin=”||-20px||false|false” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_heading title=”Normal Registration” _builder_version=”4.27.4″ _module_preset=”default” title_font=”Exo 2|600|||||||” title_text_align=”center” title_text_color=”#0C71C3″ title_font_size=”26px” background_color=”#FFFFFF” width=”94%” module_alignment=”center” border_radii=”on|8px|8px|8px|8px” global_colors_info=”{}”][\/et_pb_heading][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_4,1_4,1_4,1_4″ use_custom_gutter=”on” gutter_width=”2″ disabled_on=”off|off|off” _builder_version=”4.27.4″ width=”57%” width_tablet=”” width_phone=”60%” width_last_edited=”on|phone” custom_margin=”||||false|false” custom_padding=”||||false|false” animation_style=”slide” global_colors_info=”{}”][et_pb_column type=”1_4″ _builder_version=”4.27.4″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Student<\/h2>\n

(IEEE Member)<\/h2>\n

RM1100<\/h1>\n

(USD260)<\/h3>\n

[\/et_pb_text][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Regular<\/h2>\n

(IEEE Member)<\/h2>\n

RM1200<\/h1>\n

(USD300)<\/h3>\n

[\/et_pb_text][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Non-Member<\/h2>\n

 <\/p>\n

RM1400<\/h1>\n

(USD350)<\/h3>\n

[\/et_pb_text][\/et_pb_column][et_pb_column type=”1_4″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” header_font=”Exo|600|||||||” header_text_color=”#0C71C3″ header_2_font=”Exo 2|700|||||||” header_2_font_size=”16px” header_3_font=”Exo|700|||||||” header_3_text_color=”#0C71C3″ header_3_font_size=”18px” background_color=”#FFFFFF” custom_margin=”||0px||false|false” custom_padding=”14px||4px||false|false” border_radii=”on|14px|14px|14px|14px” global_colors_info=”{}”]<\/p>\n

Non-Presenter<\/h2>\n

 <\/p>\n

RM600<\/h1>\n

(USD150)<\/h3>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”4_4″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_text _builder_version=”4.27.4″ _module_preset=”default” text_text_color=”#FFFFFF” text_font_size=”16px” global_colors_info=”{}”]<\/p>\n

*Student authors with multiple accepted papers must register one of the papers as full registration and the others as student registration.<\/p>\n

**Overseas participants may opt for online presentation.<\/strong><\/span><\/p>\n

[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_2,1_2″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”1_2″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_button button_url=”https:\/\/fke.utm.my\/ece2025\/submission\/” button_text=”Paper Submission” button_alignment=”center” _builder_version=”4.27.4″ custom_button=”on” button_text_size=”14px” button_text_color=”#001955″ button_bg_color=”#fdba5f” button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_margin=”-1px|||||” custom_padding=”10px|30px|10px|30px|true|true” global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][et_pb_column type=”1_2″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_button button_url=”https:\/\/fke.utm.my\/ece2025\/registration-2\/” button_text=”REGISTRATION” button_alignment=”center” _builder_version=”4.27.4″ custom_button=”on” button_text_size=”14px” button_text_color=”#001955″ button_bg_color=”#fdba5f” button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_margin=”-1px|||||” custom_padding=”10px|30px|10px|30px|true|true” global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][\/et_pb_row][\/et_pb_section][et_pb_section fb_built=”1″ prev_background_color=”#ffffff” disabled_on=”off|off|off” admin_label=”Footer” _builder_version=”4.27.4″ background_color=”#002680″ use_background_color_gradient=”on” background_color_gradient_direction=”190deg” background_color_gradient_stops=”rgba(0,0,0,0.1) 0%|rgba(0,0,0,0) 21%” background_color_gradient_overlays_image=”on” background_color_gradient_start=”rgba(0,0,0,0.1)” background_color_gradient_end=”rgba(0,0,0,0)” background_color_gradient_end_position=”21%” background_enable_image=”off” custom_padding=”8vw||8vw||true|false” top_divider_style=”wave2″ top_divider_height=”152px” locked=”off” global_colors_info=”{}”][et_pb_row column_structure=”3_5,2_5″ custom_padding_last_edited=”on|phone” disabled_on=”on|on|on” _builder_version=”4.16″ custom_padding=”||||false|false” custom_padding_tablet=”|24%|||false|false” custom_padding_phone=”|10%|||false|false” disabled=”on” global_colors_info=”{}”][et_pb_column type=”3_5″ _builder_version=”4.16″ global_colors_info=”{}”][et_pb_text _builder_version=”4.16″ text_font=”Exo 2|||on|||||” text_text_color=”#0e4de3″ text_letter_spacing=”1px” locked=”off” global_colors_info=”{}”]<\/p>\n

Get Started<\/p>\n

[\/et_pb_text][et_pb_text _builder_version=”4.16″ header_2_font=”Exo 2|600|||||||” header_2_font_size=”48px” header_2_line_height=”1.3em” header_2_font_size_tablet=”32px” header_2_font_size_phone=”20px” header_2_font_size_last_edited=”on|phone” locked=”off” global_colors_info=”{}” header_2_2_font_size_tablet=”32px” header_3_2_font_size_tablet=”32px” header_4_2_font_size_tablet=”32px” header_5_2_font_size_tablet=”32px” header_6_2_font_size_tablet=”32px” header_2_2_font_size_phone=”20px” header_3_2_font_size_phone=”20px” header_4_2_font_size_phone=”20px” header_5_2_font_size_phone=”20px” header_6_2_font_size_phone=”20px” header_2_2_font_size_last_edited=”on|phone” header_3_2_font_size_last_edited=”on|phone” header_4_2_font_size_last_edited=”on|phone” header_5_2_font_size_last_edited=”on|phone” header_6_2_font_size_last_edited=”on|phone”]<\/p>\n

It’s Never Too Late or Too Early to Get Started<\/h2>\n

[\/et_pb_text][et_pb_text _builder_version=”4.16″ text_font=”PT Sans||||||||” text_font_size=”16px” text_line_height=”1.9em” text_font_size_tablet=”15px” text_font_size_phone=”14px” text_font_size_last_edited=”on|desktop” text_orientation_tablet=”center” text_orientation_last_edited=”off|tablet” locked=”off” global_colors_info=”{}”]<\/p>\n

Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam.<\/p>\n

[\/et_pb_text][et_pb_button button_text=”Contact us” _builder_version=”4.16″ custom_button=”on” button_text_size=”14px” button_text_color=”#ffffff” button_bg_color=”#0e4de3″ button_border_width=”0px” button_letter_spacing=”1px” button_font=”Exo 2|500||on|||||” custom_padding=”10px|30px|10px|30px|true|true” box_shadow_style=”preset3″ box_shadow_color=”rgba(14,77,227,0.2)” locked=”off” global_colors_info=”{}”][\/et_pb_button][\/et_pb_column][et_pb_column type=”2_5″ _builder_version=”4.16″ global_colors_info=”{}”][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=”1_3,2_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_column type=”1_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_heading title=”Uncover the Soul of Southern Malaysia!” _builder_version=”4.27.4″ _module_preset=”default” title_font=”Exo 2|600|||||||” title_text_align=”center” title_text_color=”#FFFFFF” title_font_size=”47px” background_color=”#cf0820″ module_alignment=”center” custom_margin=”0px||||false|false” custom_padding=”100px|20px|100px|20px|true|true” animation_style=”slide” animation_direction=”left” border_radii=”on|28px|28px|28px|28px” box_shadow_style=”preset2″ global_colors_info=”{}”][\/et_pb_heading][\/et_pb_column][et_pb_column type=”2_3″ _builder_version=”4.27.4″ _module_preset=”default” global_colors_info=”{}”][et_pb_video src=”https:\/\/youtu.be\/n3TDXhV6RSw?si=iAGbbz0kkMGYeUNy” _builder_version=”4.27.4″ _module_preset=”default” animation_style=”slide” animation_direction=”bottom” border_radii=”on|30px|30px|30px|30px” box_shadow_style=”preset2″ global_colors_info=”{}”][\/et_pb_video][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>\n","protected":false},"excerpt":{"rendered":"

WelcomeECE20252nd International Conference on Electronic and Computer Engineering Holiday Inn Johor Bahru City Centre, Johor, Malaysia 21-22 August 2025  Proceeding PublishedCheck it out now!Conference TracksAbout ECE2025The 2nd International Conference on Electronic and Computer Engineering (ECE2025) will be held on 21-22 Aug 2025 at Johor Bahru. The conference is organized by the Department of Electronic and […]<\/p>\n","protected":false},"author":52,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","footnotes":""},"class_list":["post-28","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/fke.utm.my\/ece2025\/wp-json\/wp\/v2\/pages\/28","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/fke.utm.my\/ece2025\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/fke.utm.my\/ece2025\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/fke.utm.my\/ece2025\/wp-json\/wp\/v2\/users\/52"}],"replies":[{"embeddable":true,"href":"https:\/\/fke.utm.my\/ece2025\/wp-json\/wp\/v2\/comments?post=28"}],"version-history":[{"count":0,"href":"https:\/\/fke.utm.my\/ece2025\/wp-json\/wp\/v2\/pages\/28\/revisions"}],"wp:attachment":[{"href":"https:\/\/fke.utm.my\/ece2025\/wp-json\/wp\/v2\/media?parent=28"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}